Ultrasonic bonding equipment - List of Manufacturers, Suppliers, Companies and Products

Standalone Ultrasonic Welding Machine UB2000/3000/5000SA

In addition to joining the same type of metal, welding enables the joining of different types of metals that is difficult to achieve!

The "UB2000/3000/5000SA" is an ultrasonic welding machine suitable for secondary batteries and power-related devices. Equipped with comprehensive process monitoring functions, it allows for detailed understanding of process operations through various sensor information built into the device, making it effective for process startup and mass production management. Additionally, the built-in linear encoder and rigid clamp in the welding head accurately control the position of the weld joint with a high-rigidity ultrasonic horn unit. 【Features】 ■ High-rigidity horn clamp mechanism ■ High-precision position control ■ High-performance load control ■ Comprehensive process monitoring functions *For more details, please refer to the PDF materials or feel free to contact us.

Company：アドウェルズ
Price：Other

Welding Machine

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Introducing the latest applications of next-generation secondary batteries!

From research and development of next-generation secondary batteries to mass production. Providing ultrasonic joining devices/ultrasonic cutters!

In the manufacturing of "next-generation secondary batteries," including all-solid-state batteries, various forms of joining and material cutting are required to meet high quality standards. Additionally, when performing joining or cutting processes, measures must be taken in the manufacturing equipment to prevent the generation of hydrogen sulfide due to reactions with moisture in the air. Our company offers "ultrasonic bonding devices and ultrasonic cutters" designed for next-generation secondary battery specifications, aimed at the joining/cutting of electrode foils, joining between battery terminals, and cutting of green sheets. Each device utilizes our unique technology based on ultrasonic waves, enabling high-quality direct bonding at room temperature and cutting without dragging the material. We also provide a dry environment where the evaluation conditions and equipment specifications can be verified with actual machines, allowing for consideration of implementation. 【Features of the Equipment】 <Joining> ■ Ultrasonic bonding device capable of wide-ranging foil bonding and compatible with dry environments <Cutting> ■ Ultrasonic cutter capable of straight/shape cutting and suitable for dry environments ■ Can cut negative electrode foils, positive electrode foils, Li foils, etc. <Fusing> ■ Can continuously and freely fuse separator materials through programming For more details about the products, please refer to the materials. Feel free to contact us with any inquiries.

Company：アドウェルズ
Price：Other

Plastic processing machines (cutting and rolling)

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Introduction to Heat Sink Formation Technology Using Ultrasonic Welding

Directly forming heat dissipation fins (pin fins/ribbon fins) on the back of the substrate achieves a high thermal conductivity (approximately 34 times that of TIM and about 7 times that of solder).

The Adwells ultrasonic pin bonding device PB2000MS and ribbon bonder RB0300SS can directly form heat dissipation pins and substrate mounting pins on ceramic substrates and organic substrates. With ultrasonic bonding, it is possible to form heat sinks without using TIM or solder, achieving a thermal conductivity approximately 34 times that of TIM and about 7 times that of solder. (Figure 1) The formation of heat sinks through ultrasonic bonding comes in two types: pin bonding and ribbon bonding. In pin bonding, simultaneous bonding of up to 4 pins can be achieved at once, allowing for programmable heat sink formation. (Photo 1) In ribbon bonding, Cu ribbons or Al ribbons are continuously bonded to form heat sinks. The device is equipped with a multi-feeder, allowing for automatic switching of ribbon materials and thicknesses. (Photo 2) ~ For more details, please download the PDF document and check it out ~ *) We also accept evaluation tests using demo machines, so if you are interested, please contact us using the form below.

Company：アドウェルズ
Price：Other

Welding Machine

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Ultrasonic welding device "Manufactured by Adwells Co., Ltd."

Achieved stable bonding through high-rigidity horn clamp technology (rigid clamp)!

Adwells contributes to the advancement of technology development aimed at energy saving, electrification, and weight reduction in electronics products, automobiles, and industrial equipment through ultrasonic joining devices that enable room temperature, short time, and dissimilar metal joining.

Company：日精本社
Price：10 million yen-50 million yen

aluminum
Secondary Cells/Batteries

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Introducing the latest applications for power devices!

From R&D for power devices to mass production. Providing ultrasonic bonding equipment!

Ultrasonic bonding devices used in various fields, such as power module terminal bonding and dissimilar metal bonding. At Adwells, we offer a lineup of "ultrasonic bonding devices" for a wide range of applications from R&D to mass production. Each device is compatible with terminal bonding, heat sink formation, DMB bonding, and more. We also conduct evaluation tests with demo units, so if you are interested, please contact us using the form below. 【Features of the device】 Terminal Bonding - Covers optimal bonding conditions for various terminals with a single device - Starts bonding by pressing down on the float with grounding load Heat Sink Formation - Directly forms fins (pins/ribbons) on the back surface of the substrate - High thermal conductivity (37 times that of TIM) due to direct bonding DMB Bonding - Can bond materials that can only handle low load and low output - No surface damage to materials during bonding: patternless horn - High thermal conductivity: about 7 times that of solder - Large area bonding *For more details, please refer to the PDF document or feel free to contact us.